(module Housings_SSOP:SSOP-24_3.9x8.7mm_Pitch0.635mm (layer F.Cu) (tedit 5627F0C0)
  (descr "SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)")
  (tags "SSOP 0.635")
  (attr smd)
  (fp_text reference REF** (at 0 -5.273) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value SSOP-20_3.9x8.7mm_Pitch0.635mm (at 0 5.527) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -3.45 -4.523) (end -3.45 4.777) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.45 -4.523) (end 3.45 4.777) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.45 -4.523) (end 3.45 -4.523) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.45 4.777) (end 3.45 4.777) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.075 -4.348) (end -2.075 -3.7905) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.075 -4.348) (end 2.075 -3.7905) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.075 4.602) (end 2.075 4.0445) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.075 4.602) (end -2.075 4.0445) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.075 -4.348) (end 2.075 -4.348) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.075 4.602) (end 2.075 4.602) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.075 -3.7905) (end -3.2 -3.7905) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.6 -2.7305) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.6 -2.0955) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.6 -1.4605) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.6 -0.8255) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.6 -0.1905) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -2.6 0.4445) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -2.6 1.0795) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -2.6 1.7145) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -2.6 2.3495) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at -2.6 2.9845) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 2.6035 2.9845) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 2.6035 2.3495) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 2.6 1.7145) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 2.6 1.0795) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 2.6 0.4445) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 2.6 -0.1905) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 2.6 -0.8255) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 2.6 -1.4605) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 2.6 -2.0955) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 2.6 -2.7305) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/SSOP-24_3.9x8.7mm_Pitch0.635mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)