| 1 | (module Housings_SSOP:SSOP-24_3.9x8.7mm_Pitch0.635mm (layer F.Cu) (tedit 5627F0C0)
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| 2 | (descr "SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)")
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| 3 | (tags "SSOP 0.635")
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| 4 | (attr smd)
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| 5 | (fp_text reference REF** (at 0 -5.273) (layer F.SilkS)
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| 6 | (effects (font (size 1 1) (thickness 0.15)))
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| 7 | )
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| 8 | (fp_text value SSOP-20_3.9x8.7mm_Pitch0.635mm (at 0 5.527) (layer F.Fab)
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| 9 | (effects (font (size 1 1) (thickness 0.15)))
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| 10 | )
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| 11 | (fp_line (start -3.45 -4.523) (end -3.45 4.777) (layer F.CrtYd) (width 0.05))
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| 12 | (fp_line (start 3.45 -4.523) (end 3.45 4.777) (layer F.CrtYd) (width 0.05))
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| 13 | (fp_line (start -3.45 -4.523) (end 3.45 -4.523) (layer F.CrtYd) (width 0.05))
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| 14 | (fp_line (start -3.45 4.777) (end 3.45 4.777) (layer F.CrtYd) (width 0.05))
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| 15 | (fp_line (start -2.075 -4.348) (end -2.075 -3.7905) (layer F.SilkS) (width 0.15))
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| 16 | (fp_line (start 2.075 -4.348) (end 2.075 -3.7905) (layer F.SilkS) (width 0.15))
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| 17 | (fp_line (start 2.075 4.602) (end 2.075 4.0445) (layer F.SilkS) (width 0.15))
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| 18 | (fp_line (start -2.075 4.602) (end -2.075 4.0445) (layer F.SilkS) (width 0.15))
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| 19 | (fp_line (start -2.075 -4.348) (end 2.075 -4.348) (layer F.SilkS) (width 0.15))
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| 20 | (fp_line (start -2.075 4.602) (end 2.075 4.602) (layer F.SilkS) (width 0.15))
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| 21 | (fp_line (start -2.075 -3.7905) (end -3.2 -3.7905) (layer F.SilkS) (width 0.15))
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| 22 | (pad 1 smd rect (at -2.6 -2.7305) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 23 | (pad 2 smd rect (at -2.6 -2.0955) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 24 | (pad 3 smd rect (at -2.6 -1.4605) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 25 | (pad 4 smd rect (at -2.6 -0.8255) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 26 | (pad 5 smd rect (at -2.6 -0.1905) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 27 | (pad 6 smd rect (at -2.6 0.4445) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 28 | (pad 7 smd rect (at -2.6 1.0795) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 29 | (pad 8 smd rect (at -2.6 1.7145) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 30 | (pad 9 smd rect (at -2.6 2.3495) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 31 | (pad 10 smd rect (at -2.6 2.9845) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 32 | (pad 11 smd rect (at 2.6035 2.9845) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 33 | (pad 12 smd rect (at 2.6035 2.3495) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 34 | (pad 13 smd rect (at 2.6 1.7145) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 35 | (pad 14 smd rect (at 2.6 1.0795) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 36 | (pad 15 smd rect (at 2.6 0.4445) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 37 | (pad 16 smd rect (at 2.6 -0.1905) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 38 | (pad 17 smd rect (at 2.6 -0.8255) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 39 | (pad 18 smd rect (at 2.6 -1.4605) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 40 | (pad 19 smd rect (at 2.6 -2.0955) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 41 | (pad 20 smd rect (at 2.6 -2.7305) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
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| 42 | (model Housings_SSOP.3dshapes/SSOP-24_3.9x8.7mm_Pitch0.635mm.wrl
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| 43 | (at (xyz 0 0 0))
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| 44 | (scale (xyz 1 1 1))
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| 45 | (rotate (xyz 0 0 0))
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| 46 | )
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| 47 | )
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